Description
3M Scotch-Weld Epoxy Potting Compound DP270 is a two-part, low viscosity, self leveling epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. Our adhesive is non-corrosive to copper and non-exothermic. Its low viscosity provides high flow rate, ideal for precise control when dispensing small amounts.
Information
$200 Minimum on all orders unless otherwise approved by MNS aviation.
Quote is valid for 30 days. All quotes are subject to prior salesSpecifications
Weight | 0.0808 kg |
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